GIGABYTE Z790 AERO G DDR5 MOTHERBOARD

Description

• CPU
  1. LGA1700 socket: Support for the 13th and 12th Generation Intel^® Core™, Pentium^® Gold and Celeron^® Processors*
  2. L3 cache varies with CPU

  * Please refer to “CPU Support List” for more information.

• Chipset
  1. Intel^® Z790 Express Chipset
• Memory
  1. Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 memory modules
  2. 4 x DDR5 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
  3. Dual channel memory architecture
  4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
  5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
  6. Support for Extreme Memory Profile (XMP) memory modules

  (Please refer “Memory Support List” for more information.)

• Onboard Graphics
  Integrated Graphics Processor-Intel^® HD Graphics support:

  1. 1 x USB Type-C^® port, supporting USB 3.2 Gen 2 and DisplayPort video outputs and a maximum resolution of 4096×2304@60 Hz
     * Support for drawing tablets and 20V@3A of power delivery.
     * Support for DisplayPort 1.4 version and HDR.
  2. 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
     * Support for HDMI 2.0 version and HDCP 2.3.

  (Graphics specifications may vary depending on CPU or graphics card support.)

• Audio
  1. Realtek^® ALC1220-VB CODEC
     * The back panel line out jack supports DSD audio.
  2. High Definition Audio
  3. 2/4/5.1/7.1-channel
     * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
  4. Support for S/PDIF Out
• LAN
  1. Intel^® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
• Wireless Communication module
  Intel^® Wi-Fi 6E AX211

  1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
  2. BLUETOOTH 5.3
  3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

  (Actual data rate may vary depending on environment and equipment.)

• Expansion Slots
  CPU:

  1. 1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x16 (PCIEX16)
     * The PCIEX16 slot shares bandwidth with the M2C_CPU connector. The PCIEX16 slot operates at up to x8 mode when a device is installed in the M2C_CPU connector
     * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.

  Chipset:

  1. 1 x PCI Express x16 slots, supporting PCIe 4.0 and running at x4 (PCIEX4_1)
  2. 1 x PCI Express x16 slots, supporting PCIe 3.0 and running at x4 (PCIEX4_2)
• Storage Interface
  CPU:

  1. 1 x M.2 connector (Socket 3, M key, type 25110/2280 PCIe 5.0 x4/x2 SSD support) (M2C_CPU)
  2. 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

  Chipset:

  1. 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2Q_SB)
  2. 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
  3. 1 x M.2 connector (Socket 3, M key, type 2280 SATA and PCIe 4.0 x4/x2 SSD support) (M2M_SB)
  4. 4 x SATA 6Gb/s connectors

  RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices
  RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices

• USB
  Chipset:

  1. 2 x USB Type-C^® ports, with USB 3.2 Gen 2×2 support (1 port on the back panel, 1 port available through the internal USB header)
  2. 1 x USB Type-C^® port on the back panel, with USB 3.2 Gen 2 support
  3. 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
  4. 2 x USB 3.2 Gen 1 ports available through the internal USB header
  5. 2 x USB 2.0/1.1 ports on the back panel

  Chipset+USB 3.2 Gen 1 Hub:

  1. 4 x USB 3.2 Gen 1 ports on the back panel

  Chipset+USB 2.0 Hub:

  1. 4 x USB 2.0/1.1 ports available through the internal USB headers